WRK LN P310 THK XEON 4 1T W8

30ASA023AR ThinkStation P310 Tower Workstation Procesador Intel® Xeon® Processor E3-1245 v5  (8M Cache, 3.50 GHz) 4GB 2133MHz DDR4, UDIMM) 1TB 7200RPM SATA 3.5" / - LectoGrabadora de DVD Placa de Video NVIDIA K620(DVI+DP) Fuente 250 Watts 80 PLUS Placa de red  10/100/1000, Puertos ; 2USB 3.0, 1 VGA and 2 DisplayPort , 2USB 2.0, 4 USB 3.0 ,1 serial Mouse y Teclado (usb) Fuente 250 Watts 80 PLUS  3 Años En Sitio Sistema Operativo Windows® 7 Professional 64 bits con Licencia Windows® 8.1  

 

Nivel de stock: Consultar Disponibilidad
Cod: LN1018
$ 36828
u$s 2040
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Financiación

 

THINKSTATION P310 TOWER & SFF

 

 

Section I: System Overview Tower

System Overview


P310 Tower

P310 SFF
The single-processor workstation P310 uses a Micro Advanced Technology Extended (MATX) motherboard, both 250 watt (W), and an optional 400 watt (W) power supply unit (PSU). The motherboard chipset consists of the Intel® PCH supporting error-correcting code (ECC) Double Data Rate 4 (DDR4). Maximum memory supported is 64GB for UDIMMs. The processor socket is an Intel® LGA1150 GA-C2 level with support for dual core, quad core, processors from the Intel® Xeon line (E3-1200V5 family of processors) as well as Core i processors (i3, i5, i7). The single-processor workstation P310 uses a Micro Advanced Technology Extended (MATX) motherboard, with a 210 watt(W) power supply unit (PSU). The motherboard chipset consists of the Intel® PCH supporting error-correcting code (ECC) Double Data Rate 4 (DDR4). Maximum memory supported is 64GB for UDIMMs. The processor socket is an Intel® LGA1150 GA-C2 level with support for dual core, quad core, processors from the Intel® Xeon line (E3-1200V5 family of processors) as well as Core i (i3, i5, i7).

Operating Systems


P310 Tower

P310 SFF

Preloaded

Genuine Windows 10DG to 7® Professional 64-bit
Genuine Windows 10® Professional 64-bit
Genuine Windows 10® 64-bit

Supported

Red Hat Enterprise Linux 6.4

Preloaded

Genuine Windows 10DG to 7® Professional 64-bit
Genuine Windows 10® Professional 64-bit
Genuine Windows 10® 64-bit

Supported

Red Hat Enterprise Linux 6.4

Motherboard – P310


Form Factor

P310 Tower

P310 SFF
Board Size 248mm 248mm

Motherboard Core
   
Processor Support Intel® Xeon™ E3-1200V5 Intel® Xeon™ E3-1200V5
  Intel® i7™ Quad Core Intel® i7™ Quad Core
  Intel® i5™ Quad Core Intel® i5™ Quad Core
  Intel® i3™ Dual Core Intel® i3™ Dual Core
Socket Type LGA1151 LGA1151
Memory Support 2133 MHz 2133 MHz
QPI (GTPS) up to 9.6GT/s up to 9.6GT/s
Voltage Regulator 80W TDP 80W TDP
Chipset (PCH) Intel C236 Intel C236
Flash 16MB 16MB
HW Monitor - -
Super I/O Nuvoton NCT6685D Nuvoton NCT6685D
Clock Greenlow Native isCLK(Intel C236) Greenlow Native isCLK(Intel C236)
Audio ALC662VD-GR ALC662VD-GR
Ethernet Intel I219-LM Intel I219-LM

Memory
   
Slots 4 4
Channels 2 2
Type UDIMM UDIMM
ECC Support Yes (with Xeon Processor) Yes (with Xeon Processor)
Speed 2133 MHz 2133 MHz
Max DIMM Size 16GB 16GB
Max System Memory 64GB 64GB

Ethernet
   
Vendor Intel Intel
Count 1 1
EEPROM None None
Speeds 10/100/1000 Mbps 10/100/1000 Mbps
Functions PXE, WOL,AMT PXE, WOL,AMT
Connectors (1) x RJ45 on Rear I/O (1) x RJ45 on Rear I/O

Audio
   
Type Integrated Audio Integrated Audio
Chipset ALC662VD-GR ALC662VD-GR
Stereo Conversion 24-bit DAC and 24-bit ADC 24-bit DAC and 24-bit ADC
High Definition Stereo Support v v
Number of Channels 2 channels (5.1 via Driver Selection) 2 channels (5.1 via Driver Selection)
Number of Bits/Audio Resolution 6 channels of DAC support 16/20/24-bit PCM format for 5.1 audio solution
2 stereo ADC support 16/20-bit PCM format
6 channels of DAC support 16/20/24-bit PCM format for 5.1 audio solution
2 stereo ADC support 16/20-bit PCM format
Sampling Rate (recording/playback) Support 44.1K/48K/96K sample rate Support 44.1K/48K/96K sample rate
Signal to Noise Ratio DAC SNR>98dBFSA, ADC SNR>90dBFSA DAC SNR>98dBFSA, ADC SNR>90dBFSA
Wavetable Voices 32-voice wavetable(For XP only) 32-voice wavetable(For XP only)
Analog Audio v v
Dolby Digital None None
THX None None
Digital Out (S/PDIF) None None
Speaker Power Rating Int Speaker (1.5W) / Ext 2.0 Speaker (4W) Int Speaker (1W) / Ext 2.0 Speaker (4W)

Video
   
Onboard Supported (On some Processors) Supported (On some Processors)
Type Integrated (Some Processors) Integrated (Some Processors)
Bus Interface Processor onboard Processor onboard
Display Interface VGA/DP/DP VGA/DP/DP
Video Resolution (max) DP: 4096×2304@60Hz DP: 4096×2304@60Hz
Graphics Cover Name Intel HD Graphics 530 Intel HD Graphics 530

Storage
   
Floppy None None
IDE None None
SATA (5) x SATA Connectors, Gen. 3
(1) x eSATA Connector, Gen. 3
(5) x SATA Connectors, Gen. 3
(1) x eSATA Connector, Gen. 3
  SATA RAID 0,1,5,10 supported natively via Intel Controller SATA RAID 0,1,5 supported natively via Intel Controller
eSATA (1) x eSATA Connector, Gen. 3 (1) x eSATA Connector, Gen. 3

Slots
   
PCI No No
Available Slots No No
PIN Count No No
Data Bus Width No No
Voltage No No
PCI Express x1 2pcs 2pcs
Available Slots 1 Full High 1 Low Profile
PIN Count 36 pins connectors 36 pins connectors
Data Bus Width 500MB/s per Direction; duplex 16GB/s 500MB/s per Direction; duplex 16GB/s
Voltage 12V 12V
Power (Max) 25W 25W
PCI Express x4 Yes Yes
Available Slots 1 Full Height 1 Half High
PIN Count 164 pins connectors 164 pins connectors
Data Bus Width 8GB/s per Direction ; duplex 1GB/s 8GB/s per Direction ; duplex 1GB/s
Voltage 12V 12V
Power (Max) 75W 45W
PCI Express x16 Yes Yes
Available Slots 1 Full High 1 Half High
PIN Count 164 pins connectors 164 pins connectors
Data Bus Width 8GB/s per Direction; duplex 16GB/s 8GB/s per Direction; duplex 16GB/s
Voltage 12V 12V
Power (Max) 75W 45W

I/O
   

Front
   
High Speed USB 3.0 2 2
Internal High Speed USB 2.0 0 0
Microphone 1 1
Headphone 1 1

Back
   
High Speed USB 2.0 2 2
High Speed USB 3.0 4 4
1 standard serial, 1 optional via punching out Yes Yes
Optional parallel Yes(header on MB) No
2 PS/2 Yes(header on MB) optional, via punching out
integrated VGA port 1 1
integrated Display port 2 2
RJ45 1 1
RJ11 (on selected models) 0 0
IEEE 1394 (on selected models) 0 0
Audio Line in 1 1
Audio line out 1 1
Mic In 1 1
eSATA 1 optional E-SATA 1 optional E-SATA

Thermal
   
Temp Sensors Ambient Cable Thermal Sensor Ambient Cable Thermal Sensor
  VR Temperature Sensor VR Temperature Sensor
  PSU Thermal Sensor(inside) PSU Thermal Sensor(inside)
Fans Rear SYSTEM Fan x1 4-pin header with 4-pin key Rear SYSTEM Fan x1 4-pin header with 4-pin key
  Front Fan 4-pin header with 4 pin key Front Fan 4-pin header with 4 pin key
  ODD bay Fan 4-pin header with 3-pin key ODD bay Fan 4-pin header with 3-pin key
  PSU Fan Main PSU power connector PSU Fan Main PSU power connector
  CPU Fan Header x1 4-pin header with 4-pin key CPU Fan Header x1 4-pin header with 4-pin key

Power Connectors
   
Main (1) 10-Pin (2×5) ATX Standard (1) 10-Pin (2×5) ATX Standard
Memory & CPU 4-Pin 4-Pin
Graphics 6-Pin (400W) (None for 250W) None

Security
   
TPM TPM 1.2 TPM 1.2
Asset ID Rohm BUL08-1FJ-W/FVJ-W/NXP PCA24S08AD Rohm BUL08-1FJ-W/FVJ-W/NXP PCA24S08AD
vPro E3 12xx v5 yes E3 12xx v5 yes

BIOS
   
Vendor AMI AMI

Chassis Information

P310 Tower P310 SFF
25L Rack Mountable Tower 12L Rack Mountable Tower
425mm H x 175mm W x 431mm D 338mm H x 102mm W x 375mm D
TWR(13kg(net weight)+1.3kg(carton+paper)+0.47kg(plastic)+0.9375kg(wood) = 15.7075 kg) SFF(7.9kg(net weight)+1.05kg(carton+paper)+0.36kg(plastic)+0.9375kg(wood) = 10.2475 kg)
250 watt 85% efficient tool-less power supply
400 watt 92% efficient tool-less power supply
210 watt 85% efficient tool-less power supply
210 watt 92% efficient tool-less power supply
Rear Fan Standard – Optional Front fan required for some configurations Rear Fan Standard – Optional Front fan required for some configurations

Security & Serviceability

Access Panel Tool-less side cover removal
Optical Drive Tool-less
Hard Drives Tool-less
Expansion Cards Tool-less
Processor Socket Tool-less
Color coded User Touch Points Yes
Color-coordinated Cables and Connectors Yes
Memory Tool-less
System Board Tool-less
Green Color Power LED on Front of Computer Yes
Restore CD/DVD Set Restore system to original factory shipping image – Can be obtained via Lenovo Support
Cable Lock Support Yes, Optional Kensington Cable Lock
Serial, Parallel, USB, Audio, Network, Enable/Disable Port Control Yes
Power-On Password Yes
Setup Password Yes
NIC LEDs (integrated) Yes
Security Chip Yes
Access Panel Key Lock Optional
Boot Sequence Control Yes
Padlock Support Yes, loop in rear for optional padlock, prevents side panel removal
Boot without keyboard and/or mouse Yes

Operating Environment

Air Temperature • Operating: 10°C to 35°C (50°F to 95°F)
  • Storage: -40°C to 60°C (-40°F to 140°F) in original shipping carton
  • Storage: -10°C to 60°C (14°F to 140°F) without carton
Humidity Operating 20% ~ 80% (non-condensing)
  Non-Operating 20% ~ 90%(non-condensing)
  • Wet Bulb Temperature Operating: 25°C max
Altitude Operating: -15.2 m to 3048 m (-50 ft to 10 000 ft)
Vibration With Packaging 1.04 G at 2 to 200 Hz at 1 octave/min
  Operating: 0.27 G at 5 to 500 Hz at 0.5 octave/min,Ramdom(without LCD panel)
  Non- operatig 1.04 G at 2 to 200 Hz at 1 octave/min
Shock Without Package: Bottom half-sine pulse with a change in velocity of 37.4 cm/sec (14.7 inches/sec)
  Operating: 45-G faired square wave with a velocity change of 441 cm/sec (173.7 inches/sec)

Regulations and Standards

EMC & Safety

FCC DoC for North America Yes
VCCI certification for Japan Yes
BSMI certification for Taiwan Yes
EU/EFTA CE Mark & DoC Yes
UL/CUL Yes
TUV-GS Yes
IEC60950-1 CB Report/Certificate Yes
Saudi Arabia ICCP(SASO) Yes
China CCC Mark Yes
Hong Kong SAR (CB report) Yes
Argentina S-mark Yes
Singapore – PSB Yes
South Africa – SABS Yes
Russia-GOST/EAC Yes
Mexico-NOM Yes
Kazakhstan -GOST-K /EAC Yes
Belarus-certificate/EAC Yes
Croatia-certificate/CE Yes
Serbia – KVALITET Yes
Ukraine – UKrCEPRO Yes
Energy Star 6.1 Yes
PERD(Product Environmental Review Database Yes
China RoHS Yes
EU RoHS Yes
EU WEEE Yes
Japan J-Moss Yes
California RoHS Yes
USA Chemical Emission Test Yes
New York RoHS Yes
Japan Energy Saving Yes

Environmentals

Energy Star Energy Star Program Requirements for Computers: Version 6.1 (select models)
EPEAT EPEAT™ Gold rating (select models)
EuP Lot-3 2013 EuP Lot-3 2013 (Enabled via system setup. Default on for systems shipped to EMEA.)
Hazardous Substances • Products do not contain more than; 0.1% lead, 0.01% cadmium, 0.1% mercury, 0.1% hexavalent chromium, 0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated diphenol ethers (PBDE).
  • Products do not contain Asbestos.
  • Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC), hydrobromofluorocarbons (HBFC), hydrochlorofluorcarbons (HCFC), Halons, carbontetrachloride, 1,1,1-trichloroethane, methyl bromide
  • Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005% polychlorinated terphenyl (PCT) in preparation.
  • Products do not contain more than 0.1% short chain chloroparaffins (SCCP) with 10-13 carbon atoms in the chain containing at least 48% per mass of chlorine in the SCCP
  • Parts with direct and prolonged skin contact do not release nickel in concentrations above 0.5 microgram/cm²/week.

Section II: Supported Components

Processor

E3-1280 v5 ( 3.7GHz / 4C / 8M / 2133 / 80W / Turbo / HT / GT0 )
E3-1275 v5 ( 3.6GHz / 4C / 8M / 2133 / 80W / Turbo / HT / GT2 )
E3-1270 v5 ( 3.6GHz / 4C / 8M / 2133 / 80W / Turbo / HT / GT0 )
E3-1245 v5 ( 3.5GHz / 4C / 8M / 2133 / 80W / Turbo / HT / GT2 )
E3-1240 v5 ( 3.5GHz / 4C / 8M / 2133 / 80W / Turbo / HT / GT0 )
E3-1230 v5 ( 3.4GHz / 4C / 8M / 2133 / 80W / Turbo / HT / GT0 )
E3-1225 v5 ( 3.3GHz / 4C / 8M / 2133 / 80W / Turbo / GT2 )
E3-1220 v5 ( 3.0GHz / 4C / 8M / 2133 / 80W / Turbo / GT0 )
i7-6700 (3.4GHz / 4c / 8M / 2133 / 65W )
i5-6600 (3.3GHz / 4c / 6M / 2133 / 65W )
i5-6500 (3.2GHz / 4c / 6M / 2133 / 65W )
i5-6400 (2.7GHz / 4c / 6M / 2133 / 65W )
I3-6100 (3.7GHz / 2C / 3M /2133 / 65W )
I3-6300 (3.8GHz / 2C / 4M /2133 / 65W )
I3-6320 (3.9GHz / 2C / 4M /2133 / 65W )
Multi core technologies are designed to improve performance of multithreaded software products and hardware-aware multitasking operating systems and may require appropriate operating system software for full benefits; check with software provider to determine suitability; not all customers or software applications will necessarily benefit from use of these technologies.
64-bit computing on Intel® 64 architecture requires a computer system with a processor, chipset, BIOS, operating system, device drivers, and applications enabled for Intel® 64 architecture. Processors will not operate (including 32-bit operation) without an Intel® 64 architecture-enabled BIOS. Performance will vary depending on your hardware and software configurations

Memory

UDIMMs – 2133MHz
4GB PC4-2133MHz DDR4 ECC-UDIMM
8GB PC4-2133MHz DDR4 ECC-UDIMM
16GB PC4-2133MHz DDR4 ECC-UDIMM
4GB PC4-2133MHz DDR4 non-ECC-UDIMM
8GB PC4-2133MHz DDR4 non-ECC-UDIMM
16GB PC4-2133MHz DDR4 non-ECC-UDIMM

Storage

3.5″ SATA Hard Disk Drive (HDD)
500GB SATA – 7200 rpm, 6 Gb/s, 3.5″
1TB SATA – 7200 rpm, 6 Gb/s, 8MB cache, 3.5″
2TB SATA – 7200 rpm, 6 Gb/s, 3.5″
3TB SATA – 7200 rpm, 6Gb/s 3.5″
4TB SATA – 7200 rpm, 6Gb/s 3.5″

3.5″ Hybrid Drive
1TB SATA – 7200rpm,(8G Flash) 6Gb/s, 3.5″ Hybrid
2TB SATA – 7200rpm, (8G Flash) 6Gb/s, 3.5″ Hybrid

2.5″ SATA Solid State Drive (SSD)
128GB SATA 3 Solid State Drive (SSD) 2.5″,6Gb/s
180GB SATA 3 Solid State Drive (SSD) 2.5″, 6Gb/s OPAL
240GB SATA 3 Solid State Drive (SSD) 2.5″, 6Gb/s – OPAL
256GB SATA 3 Solid State Drive (SSD) 2.5″, 6Gb/s
256GB SATA 3 Solid State Drive (SSD) 2.5″, 6Gb/s OPAL
480GB SATA 3 Solid State Drive (SSD) 2.5″, 6Gb/s OPAL
512GB SATA 3 Solid State Drive (SSD),2.5″
1TB SATA 3 Solid State Drive (SSD) 2.5″

M.2 (NGFF) PCIe Solid State Drive (SSD)
256 GB M.2 PCIe – Solid State Drive (SSD), Gen3x4, OPAL NVMe
512 GB M.2 PCIe – Solid State Drive (SSD), Gen3x4, NVMe

RAID

Supported RAID levels for a system will vary from the stated capabilities of the RAID controller due to dependencies on the number and capacity of physical disks in the system and on customer requirements for performance, fault tolerance, or data redundancy. Max support RAID 0,1,5,10
RAID levels and requirements:
• RAID 0 (striping) provides increased performance by writing data across multiple drives.
• RAID 1 (mirroring) provides fault tolerance by writing the data on two drives.
• RAID 5 (striping with parity) uses distributed parity data to provide fault tolerance more efficiently than RAID 1. Requires three or more drives.
• RAID 10 (or RAID 1+0) combines
• RAID 1 and RAID 0 to create a stripe of mirrors that is fault tolerant while offering increased performance. Requires four drives.

Optical Drive/Removable Media

DVD-ROM Drive (SATA)
DVD-ROM Drive – 16x/48x (SATA)
Slim DVD-ROM
DVD Burner/CD-RW Rambo Drive (SATA)
DVD Burner/CD-RW Rambo Drive (SATA)
Slim DVD Burner/CD-RW Rambo Drive (9.5mm Slim SATA)
Blu-Ray Burner Drive (SATA)
Blu-Ray Burner Drive w/AACS encryption (SATA)
Slim Blu-Ray ODD DVD Burner (SATA)
 

Media Card Reader
Front 9 in 1 Media Card reader Standard
Front 29 in 1 Media card reader, USB3.0, MPOB, 760mm (Requires FLEX Module)

Keyboard

Preferred Pro Fullsize Keyboard (USB)
Preferred Pro Fullsize Keyboard (PS/2)
Smart Card KYB
Chicony KUF1256 fingerprint KB
Lenovo Slim New F5 USB Keyboard

Pointing Devices

Optical Wheel Mouse (1000 DPI), USB – red wheel
Lenovo USB Laser Mouse

Graphics Cards


P310 Tower

P310 SFF
NVIDIA NVS310 (DP, DP) NVIDIA NVS310 (DP, DP)
NVIDIA NVS315 (DMS-59) – 1GB GDDR3 w/ DMS-59 to Dual DVI Dongle(single link) – HP NVIDIA NVS315 (DMS-59) – 1GB GDDR3 w/ DMS-59 to Dual DVI Dongle(single link) – LP
NVIDIA NVS315 (DMS-59) – 1GB GDDR3 w/ DMS-59 to Dual DP Dongle – HP NVIDIA NVS315 (DMS-59) – 1GB GDDR3 w/ DMS-59 to Dual DP Dongle – LP
NVIDIA 510 (mini DP x4) – 2GB GDDR3 with 4x miniDP to DP Dongle – HP NVIDIA 510 (mini DP x4) – 2GB GDDR3 with 4x miniDP to DP Dongle – LP
NVS 810 (miniDPx8) – 4GB DDR3-ATX w/ short ext. Nvidia Quadro K420(DP/DVI) – 2GB DDR3-LP
Nvidia Quadro K420(DP/DVI) – 2GB DDR3- HP NVIDIA Quadro K620 (DVI, DP) – 2GB DDR3 – LP
NVIDIA Quadro K620 (DVI, DP) – 2GB DDR3 – HP NVIDIA Quadro K1200(miniDP x4) – 4GB GDDR5 – LP
NVIDIA Quadro K1200(miniDPx4) – 4GB GDDR5 – HP  
NVIDIA Quadro K2200(DVI, DP x2) – 4GB GDDR5 – HP  
NVIDIA Quadro M4000(DP x4) – 8GB GDDR5 ATX with short extender – HP  

FLEX Components

Flex Bay: Formerly known as ODD bays. Will support not only ODD, but also HDDs and Flex Module
Flex Module: Module supported in the Flex Bay with several options integrated. Will support slim ODD, High Speed Media Card Reader or 2 universal ports supporting IEEE1394, eSATA, etc…

PCIe

Network Integrated Gigabit Ethernet
  Intel® I210-T1 Single Port Gigabit Ethernet Adapter
  Intel® I350-T2 Dual Ports Gigabit Ethernet Adapter
  Intel® I350-T4 Quad Ports Gigabit Ethernet Adapter
Thunderbolt Intel Thunderbolt Add-In Card (optional)
IEE 1394 IEEE 1394a (Firewire-400) PCI Express x1 Adapter (1 external, 1 internal port)
USB USB 3.0 PCI Express x1 Adapter
Audio Devices SoundBlaster Z audio card optional
  Lenovo Branded 2-Piece Speaker Set
  Speaker Brick

Section III: System Technical Specifications

Power Supply Specifications

 
P310 Tower

P310 SFF
Power Supply 250W 400W 210W 210W
Power Efficiency 85% 92% 85% 92%
Manual / Auto-sensing auto-sensing auto-sensing auto-sensing auto-sensing
Wattage 250W 400W 210W 210W
AC Input Voltage Range 100~240v 100~240v 100~240v 100~240v
AC Input Current (low ac range/high AC range) 4A 6A 3A 6A
47~63 HZ 47~63 HZ 47~63 HZ 47~63 HZ
AC Holdup Time (50% load) 17ms 17ms 17ms 17ms
Minimum Efficiency 0.82 0.9 0.82 0.9
PFC (Active) active active active active

ThinkStation Power Calculator

BIOS Specifications

Features    
WMI Support Compliant with Microsoft WBEM and the DMTF Common Information Model
ROM-Based Setup Utility (F1) System Configuration Setup program available at power-on with F1 key
Bootblock Recovery Recovers system BIOS when Flash ROM corrupted.
Replicated Setup Saves System Configuration settings to file that can then be used replicated to other systems.
Boot Control Boot control available through ROM-Based Setup Utility or with F12 key at power-on
Memory Change Alert Power-on Error message in event of decrease in system memory
Thermal Alert Power-on Error message in event of fan failure
Asset Tag Support ability to set SMBIOS Type 2 Baseboard Asset Tag field.
System/Emergency ROM Flash Recovery with Video Support process to recover system BIOS when Flash ROM corrupted
Remote Wakeup/Remote Shutdown System admin can power on/off a client computer from remote location to provide maintenance
Quick Resume time Support low power S3 (suspend to RAM) and prompt resume times
ROM revision level System UEFI (BIOS) version reported in SMBIOS Type 0 structure and in BIOS Setup
Keyboard-less Operation System can be booted without a keyboard
Per-port Control Allows I/O ports to be individually enabled/disabled through ROM-based setup or WMI interface
Adaptive Cooling Fans dynamically controlled by system BIOS based on temperature.
Security User and Administrator passwords can protect boot and ROM-base Setup. Chassis intrusion detection protect
Intel(R) AMT (includes ASF 2.0) Allows system to be supported from a remote location
Intel(R) TXT Intel(R) Trusted Execution Technology provides a security foundation to build protections against software base attacks.
Memory modes Supports mirroring, lock step, and sparing memory modes
Windows 10 ready Supports Windows 10 requirements – Secure flash, UEFI v 2.3.1 spec
     

Industry Standard Specification Support
   
UEFI Unified Extensible Firmware Interface v2.3.1
ACPI (Advanced Configuration and power Management Interface) Advanced Configuration and Power Interface v4.0
ASF 2.0 DMTF Alert Standard Format Specification v2.0
ATA (IDE) None
CD Boot “El Torito” Bootable CD-Rom Format Specification, Version 1.0
EHCI None, support RAID/AHCI
PCI None
PCI Express PCI Express Base Specification 3.0
SATA Serial ATA Revision 3.0 Specification
TPM Trusted Computing Group TPM Specification Version 1.2
UHCI None
USB Universal Serial Bus Revision 1.1
Universal Serial Bus v2.0
Universal Serial Bus v3.0
SMBIOS DMTF System Management Spec v2.7.1
XHCI eXtensible Host Controller Interface for Universal Serial Bus, Revision 3.0

Social and Environmental Responsibility


Quality Control
Lenovo is a member of an eco declaration system that enforces regular independent quality control

Hazardous substances and preparation
Products do not contain more than; 0.1% lead, 0.01% cadmium, 0.1% mercury, 0.1% hexavalent chromium,
0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated diphenyl ethers (PBDE). (See legal
reference and Note B1
Products do not contain Asbestos
Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC),
hydrobromofluorocarbons (HBFC), hydrochlorofluorcarbons (HCFC), Halons, carbontetrachloride, 1,1,1-
trichloroethane, methyl bromide
Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005% polychlorinated
terphenyl (PCT) in preparation
Products do not contain more than 0.1% short chain chloroparaffins (SCCP) with 10-13 carbon atoms in the
chain containing at least 48% per mass of chlorine in the SCCP
Parts with direct and prolonged skin contact do not release nickel in concentrations above 0.5
microgram/cm²/week
REACH Article 33 information about substances in articles is available at:
http://www.lenovo.com/social_responsibility/us/en/ThinkGreen_products.html#environment

Batteries
If the product contains a battery or an accumulator, it is labeled with the disposal symbol and if it contains
more than 0.0005% of mercury (for button cells only) by weight, or more than 0.004% of lead, it shall be
marked with the chemical symbol for the metal concerned, Hg or Pb. Information on proper disposal is
provided in user manual
Button cells used in the product do not contain more than 2% by weight of mercury. Other batteries or
accumulators do not contain more than 0.0005% of mercury or 0.002% of cadmium
Batteries and accumulators are easily removable by either users or service providers (as dependent on the
design of the product). Exception: Batteries that are permanently installed for safety, performance, medical
or data integrity reasons do not have to be “easily removable

Safety, EMC connection to the telephone network and labeling
The product complies with legally required safety standards as specified
The product complies with legally required standards for electromagnetic compatibility
If product is intended for connection to a public telecom network or contains a radio transmitter, it complies
with legally required standards for radio and telecommunication devices
The product is labeled to show conformance with applicable legal requirements

Product packaging
Packaging and packaging components do not contain more than 0.01% lead, mercury, cadmium and
hexavalent chromium by weight of these together.
Plastic packaging material is marked according to ISO 11469 referring ISO 1043
The product packaging material is free from ozone depleting substances as specified in the Montreal
Protocol

For more information on Lenovo social environmental practices visit: http://www.lenovo.com/social_responsibility/us/en/ThinkGreen_products.html#environment

Manageability

Industry Standard Specifications This product meets the following industry standard specifications for manageability functionality:
• Intel LAN with AMT
Remote Manageability Software Solutions Lenovo ThinkStation is supported on the following remote manageability software consoles:
• Lenovo ThinkManagement Console

• LANDesk Management Suite for ThinkVantage Technologies (www.landesk.com/lenovo)
• Microsoft System Center Configuration Manager
System Software Manager Lenovo ThinkStation supports software management tools from the ThinkVantage System Update suite:
• System Update
• Update Retriever
• Thin Installer
Service, Support, and Warranty On-site Warranty and Service: Three-years, limited warranty and service offering delivers on-site, next business-day service for parts and labor and includes free telephone support 8am – 5pm. Global coverage ensures that any product purchased in one country and transferred to another, non-restricted country will remain fully covered under the original warranty and service offering.
Go to www.lenovo.com/support and www.lenovo.com/warranty for more details

Section IV: Component Specifications

HDD Specifications

3.5″ SATA Hard Disk Drive (HDD)
500GB SATA – 7200rpm, 6Gb/s, 3.5″
1TB SATA – 7200rpm, 6Gb/s, 3.5″
2TB SATA – 7200rpm, 6Gb/s, 3.5″
3TB SATA – 7200rpm, 6Gb/s, 3.5″
4TB SATA – 7200rpm, 6Gb/s, 3.5″

3.5″ Hybrid Drive
1TB SATA – 7200rpm, 6Gb/s, 3.5″ Hybrid
2TB SATA – 7200rpm, 6Gb/s, 3.5″ Hybrid
 
3.5″ 7200rpm HDD

3.5″ 7200rpm Hybrid
Connector SATA SATA
Transfer Rate (Gb/sec) 600MB/sec 600MB/sec

Performance
   
Spindle Speed(RPM) 7200 7200
Power off to Spindle Stop(sec) 11 max 11 max
DC Power to Drive Ready(sec) 17 max <1
Receipt of Start Unit Command to Drive Ready(sec) 17 max <1
Average Latency(msec) 4.16 4.16

Power Management
   
Input(VDC) +5v +- 5%+12v +- 5% +5v +- 5%+12v +- 5%
Typical(Watts) 8 max 6.7 max
Idle(Watts) 0.75 0.75

Dimensions
   
Height(mm – Max) 26.11 26.11
Width(mm) 101.6 101.6
Depth(mm – Max) 146.99 146.99
Weight(grams) 626 max 535 max

Temperature
   
Operating(C) Ambient 0 to 60 0 to 60
Operating(C) Base Casting    
Non-Operating(C) Ambient -40 to 70 -40 to 70
Gradient(C per Hour) 30 max 30 max

Shock
   
Operating(Gs @ 2ms) 80 max 80 max
Non-Operating(Gs @ 2ms) 350 max 350 max

SSD Specifications


2.5″ SATA Solid State Drive (SSD)
128GB SATA SSD, 6Gb/s, 2.5″ Non-OPAL
180GB SATA SSD. 6Gb/s. OPAL.2.5″
240GB SATA SSD, 6Gb/s,OPAL. 2.5″
256GB SATA SSD, 6Gb/s, 2.5″ OPAL
256GB SATA SSD, 6Gb/s, 2.5″ Non-OPAL
480GB SATA SSD, 6Gb/s,OPAL. 2.5″
512GB SATA SSD, 6Gb/s, 2.5″ Non-OPAL
1 TB SATA SSD , 6Gb/s, 2.5″ Non-OPAL

M.2 (NGFF) PCIe Solid State Drive (SSD)
256 GB M.2 PCIe – Solid State Drive (SSD), Gen2x4
256 GB M.2 PCIe – Solid State Drive (SSD), Gen3x4
512 GB M.2 PCIe – Solid State Drive (SSD), Gen3x4
256 GB M.2 PCIe NVMe- Solid State Drive (SSD), Gen3x4
512 GB M.2 PCIe NVMe- Solid State Drive (SSD), Gen3x4
 
180GB SATA SSD. 6Gb/s. OPAL.2.5″

240GB SATA SSD, 6Gb/s,OPAL. 2.5″

480GB SATA SSD, 6Gb/s,OPAL. 2.5″

128GB SATA SSD, 6Gb/s, 2.5″ Non-OPAL

256GB SATA SSD, 6Gb/s, 2.5″ OPAL

256GB SATA SSD, 6Gb/s, 2.5″ Non-OPAL

512GB SATA SSD, 6Gb/s, 2.5″ Non-OPAL

1 TB SATA SSD , 6Gb/s, 2.5″ Non-OPAL
Min Sequential Read 540 MB/s 540 MB/s 540 MB/s 510 MB/s 520 MB/s 520 MB/s 520 MB/s 560 MB/s
MIn Sequential Write 490 MB/s 490 MB/s 490 MB/s 300 MB/s 280 MB/s 280 MB/s 460 MB/s 510 MB/s
Min Random Read (8GB Span) 48000 IOPS 48000 IOPS 48000 IOPS 85000 IOPS 90000 IOPS 90000 IOPS 96000 IOPS 100,000 IOPS
Min Random Write (8GB Span) 80000 IOPS 80000 IOPS 80000 IOPS 65000 IOPS 80000 IOPS 80000 IOPS 80000 IOPS 88,000 IOPS
Min Power – Active 165 mW 165 mW 165 mW 120 mW 120 mW 120 mW 120 mW 150 mW
Min Power – Idle 55 mW 55 mW 55 mW 80 mW 50 mW 50 mW 50 mW 70 mW
Min MTBF 1.2 M hours 1.2 M hours 1.2 M hours 1.5 M hours 1.5M hours 1.5M hours 1.5M hours 1.5M hours
Hardware Encryption AES 256 bit AES 256 bit AES 256 bit AES 256 bit AES 256 bit AES 256 bit AES 256 bit AES 256 bit
Lithography 16 nm 16 nm 16 nm          

Optical Drives Specifications

Interface PCIe Gen3 x4 NVMe PCIe Gen3 x4 NVMe
Capacity 256GB 512GB
Performance Sequential Read 2,250 MB/s 2,600 MB/s
Sequential Write 1,250 MB/s 1,500 MB/s
Random Read 295,000 IOPS 310,000 IOPS
Random Write 93,000 IOPS 100,000 IOPS
Power Consumption 6.5W 5.5W

Graphics Cards


Available Graphics Drivers
Microsoft Windows 8.1 (64-bit and 32-bit)
Microsoft Windows 7 Professional (64-bit and 32-bit)
Microsoft Windows 10 Professional (64-bit)
Red Hat Enterprise Linux(RHEL) 7 Desktop/Workstation
 
M4000

K4200

K2200

K620

K420
# CUDA Cores 1664 1344 640 384 192
Single Precision 2.6 TFLOPs 2.1 TFLOPs 1.3 TFLOPs 0.8 TFLOPs 0.3 TFLOPs
PCIe Gen 3 2 2 2 2
Memory Size 8GB 4 GB 4 GB 2 GB 1 GB
Memory BW 192 GB/s 173 GB/s 80 GB/s 29 GB/s 29 GB/s
Slots + Display Connectors 4x DP 2x DP + DVI 2x DP + DVI DP + DVI DP + DVI
Display Support 4 4 4 4 4
Advanced Display SYNC SDI, SYNC, Stereo DI, SYNC, Stereo SDI, SYNC, Stereo SDI, SYNC, tereo
Board Power 120 W 108 W 68 W 45 W 41 W
SLI Support Yes Yes No No No
Form Factor FH FH FH HH HH
 
NVS310

NVS315

NVS510
# CUDA Cores 48 48 192
PCIe Gen 2 2 2
Memory Size 512 MB 1GB 2GB
Memory BW 14 GB/s 14 GB/s 28.5 GB/s
Slots + Display Connectors DMS-59 DMS-59 Mini DP
Max Display 2 2 4
Max Power 19.5 W 19.3 W 35 W
Max Resolution 2560 × 1600 at 60Hz (DP) 2560 × 1600 at 60Hz (DP) 3840×2160 at 60Hz (DP)
Form Factor HH HH HH

Networking

 
P310 Tower

P310 SFF
Connector RJ-45 RJ-45
Controller Intel 82574L Intel 82574L
Memory Integrated Dual 48K configurable transit receive FIFO Buffers Integrated Dual 48K configurable transit receive FIFO Buffers
Data Rates Supported 10/100/1000 Mbps 10/100/1000 Mbps
Compliance IEEE 802.1p, Quality of Service (QoS) Support IEEE 802.1p, Quality of Service (QoS) Support
Bus Architecture PCI-E 1.1 PCI-E 1.1
Typical Power Consumption 1.9W 1.9W
Operating Temperature 32º to 131º F (0º to 55º C) 32º to 131º F (0º to 55º C)
Storage Humidity 90% at 35ºC 90% at 35ºC
Dimensions (H x W x D) 12cm x 5.53cm x 11.92cm 12cm x 5.53cm x 11.92cm
Operating System Driver Support Windows 7 Professional 32-bit and 64-bit, Red Hat Enterprise Linux 4 (4.8 or newer), 5 (5.3 or newer), 6 Windows 7 Professional 32-bit and 64-bit, Red Hat Enterprise Linux 4 (4.8 or newer), 5 (5.3 or newer), 6
Cabling Type Category-5 up to 100m Category-5 up to 100m
Bracket Height Low Profile & Full Height Low Profile & Full Height
Max TDP 2.9 W 2.9 W
# of Ports Single Dual
System Interface Type PCIe v2.0 (2.5GT/s) PCIe v2.0 (2.5GT/s)
Intel® Virtualization Technology for Connectivity (VT-c) VMDq, VMDc VMDq, VMDc
Speed & Slot Width 2.5 GT/s, x4 Lane 2.5 GT/s, x4 Lane

Other


OPTICALS

DVD-ROM Drive – 16x/48x (SATA)

DVD Burner/CD-RW Rambo Drive (SATA)
Description 5.25-inch, half-height, tray-load 5.25-inch, half-height, tray-load
Mounting Orientation Either horizontal or vertical Either horizontal or vertical
Interface Type SATA/ATAPI SATA/ATAPI
Dimensions (WxHxD) 15.0 x 4.4 x 20.3 cm (5.9 x 1.7 x 8.0 in) (WxHxD) 15.0 x 4.4 x 20.3 cm (5.9 x 1.7 x 8.0 in)
Disc Capacity DVD-ROM Single layer: Up to 4.7 GB Double layer: Up to 8.5 GB Single layer: Up to 4.7 GB Double layer: Up to 8.5 GB

Access Times
   
DVD-ROM Single Layer < 140 ms (typical) < 140 ms (typical)
CD-ROM Mode 1 < 125 ms (typical) < 125 ms (typical)
Full Stroke DVD < 250 ms (seek) < 250 ms (seek)
Full Stroke CD < 210 ms (seek) < 210 ms (seek)

Power
   
Source SATA DC power receptacle SATA DC power receptacle
DC Power Requirements 5 VDC ± 5%-100 mV ripple p-p 5 VDC ± 5%-100 mV ripple p-p
12 VDC ± 5%-200 mV ripple p-p 12 VDC ± 5%-200 mV ripple p-p
DC Current 5 VDC – <1000 mA typical, < 1600 mA 5 VDC – <1000 mA typical, < 1600 mA
maximum maximum
12 VDC – < 600 mA typical, < 1400 mA 12 VDC – < 600 mA typical, < 1400 mA
maximum maximum

Operating Environmental
   
Temperature 5° to 50° C (41° to 122° F) 5° to 50° C (41° to 122° F)
Relative Humidity 10% to 90% 10% to 90%
Maximum Wet Bulb Temperature 30° C (86° F) 30° C (86° F)
Operating Systems Supported Windows 7 Professional 32-bit and 64-bit, Windows 7 Professional 32-bit and 64-bit,
  Windows XP Professional or Windows XP Home 32*. Windows XP Professional or Windows XP Home 32*.
  Red Hat Enterprise Linux(RHEL) WS4**, 5, 6 Red Hat Enterprise Linux(RHEL) WS4**, 5, 6
  Desktop/Workstation. No driver is required for this device. Native Desktop/Workstation. No driver is required for this device. Native
  support is provided by the operating system. support is provided by the operating system.

MEDIA CARD READER
 
9 in 1 29 in 1
  Description Description
  The Media card reader device is standard in our Pseries products The device connects to a 2×5 two channel USB header on the motherboard of the system. There is no USB controller card provided. Please see the Disc Formats section below for a list of flash memory card formats that are supported. The Media card reader mounts into our FLEX module which fits into a standared 5.25″ Optical bay
  Mounting Orientation The Media Card Reader can not be changed and is hard wired into the system Mounting Orientation The Media Card Reader can not be changed, it only fits into the FLEX Module one way
  Interface Type Interface Type
  USB 2.0 (one channel dedicated to the separate USB port; one channel dedicated to the flash memory card slots) USB 2.0 (one channel dedicated to the separate USB port; one channel dedicated to the flash memory card slots)
  Disc Formats Disc Formats
  SD xD-H
  SDHC xD-M
  SDXC Micro SD
  Mini SD Micro SDHC
  Mini SDHC SD
  Micro SD* SDHC
  Micro SDHC* SDXC
  Micro SDXC* Mini SD
  RS-MMC Mini SDHC
  MMC MultiMediaCard (MMC)
  MMC Micro Reduced Size MultiMediaCard (RS MMC)
  MMC Mobile (MMC Plus)
  MMC Plus (MMC Mobile)
  M2 CompactFlash Card Type I (CF Type 1)
    CF Type 2
    MicroDrive (MD)
    Memory Stick (MS)
    Memory Stick Select
    MS Duo
    MS PRO
    MS PRO DuMS PRO-HG Duo
    MS XS Duo
    MS XC-HG Duo
    MS HG Micro*
    MS XC Micro*
    MS XC-HG Micro*
     
    MMC Micro
    Memory Stick Micro (M2)*
 
*Available with adapter

*Available with adapter

IEEE 1394a (Firewire-400) PCI Express x1 Adapter (1 internal port, 1 external port)
Data Transfer Rate Supports up to 400 Mbps
Devices Supported IEEE-1394 compliant devices
Bus Type PCIe card full height PCIe slots
Ports One IEEE-1394a bilingual 6-Pin Connector (Rear)
System Requirements Windows 7 Professional 32-bit and 64-bit, Microsoft® Windows® XP
Professional. Not supported on Linux. Pentium® III or higher processor 128-MB RAM 1-GB Hard Drive CD-ROM drive Built in sound system Available PCI slot
Temperature – 50° to 131° F (10° to 55° C)
Operating
Temperature – Storage –22° to 140° F (–30° to 60° C)
Relative Humidity – 20% to 80%
Operating
Compliances FCC Part 15B, cULus 60950, CE Mark EN55022B(1995)/EN55024-
1998 STD, Taiwan BSMI CNS13438, Korea MIC
Operating Systems Windows 7 Professional 32-bit and 64-bit,
Supported Windows® XP Professional, XP Professional 64-bit.
  Not supported on Linux

 

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